M-Plex Bond Repairing Shampoo

1. M-Plex Bond Technology, our new and innovative bond-building technology, helps protect, strengthen and repair damaged hair from harmful effects. Its innovative composition leads to enhanced performance for outstanding softening and shine.
2. Hydropower Bond Technology, with Coconut Water and Abyssinian Oil, nourishes and seals the cuticle for smoother, healthier-looking hair.

Ingredients:

Aqua (Water/Eau), Sodium C14-16 Olefin Sulfonate, Cocamidopropyl Hydroxysultaine, Decyl Glucoside, Cocamide MIPA, Glycol Distearate, Fragrance/Parfum, Methyl Gluceth-20, Sodium Cocoyl Glutamate, Bis-PCA Dimethicone, Disodium PEG-12 Dimethicone Sulfosuccinate, Hydrolyzed Adansonia Digitata (Baobab) Extract, Hydrolyzed Linseed Seed, Aloe Barbadensis Leaf Juice, Camellia Sinensis Leaf (Green Tea) Extract, Aspalathus Linearis Leaf (Rooibos) Extract, Cocos Nucifera (Coconut) Liquid Endosperm, Lycium Barbarum (Goji) Fruit Extract, Olea Europaea (Olive) Fruit Oil, Crambe Abyssinica (Abyssinian) Seed Oil, Divinyldimethicone/Dimethicone Copolymer, C12-13 Pareth-23, C12-13 Pareth-3, Amodimethicone, C11-15 Pareth-7, Laureth-9, Sodium Chloride, Trideceth-12, PEG-150 Pentaerythrityl Tetrastearate, Tocopheryl Acetate, Biotin, Panthenol, Phenoxyethanol, Maltodextrin, Guar Hydroxypropyltrimonium Chloride, Glycerin, Olea Europaea (Olive) Fruit Extract, Malpighia Glabra (Acerola) Fruit Extract, Persea Gratissima (Avocado) Oil, Polysilicone-15, Helianthus Annuus (Sunflower) Seed Extract, Salvia Hispanica (Chia) Seed Extract, Saccharomyces Cerevisiae (Brewer’s Yeast) Extract, Leuconostoc/Radish Root Ferment Filtrate, Guar Hydroxypropyltrimonium Chloride, Butylene Glycol, Aminomethyl Propanol, Acrylates Copolymer, Benzyl Alcohol, Benzoic Acid, Tetrasodium EDTA, Potassium Sorbate, Sodium Benzoate, Linalool, Benzyl Benzoate, Limonene, Iodopropynyl Butylcarbamate, Citric Acid.